視覺識別系統 
			Recognition System | 
			判別方法 
			Inspection | 
			AI智能瑕疵判別系統,矢量分析演算法,集成瑕疵追踪演算法,雙光源瑕疵追踪,元件本體瑕疵,OCV,亮度補償校正,色差檢測,反射光抑制,光源控制亮度選擇20檔 
			AI Inteligent detection algorithmt, he vector image algorithms include logic operation, distance of luminance boundary, chip tracing, OCR/OCV, luminance/color template matching, color distance, etraction (RGB & HSV), value-range of lumirance, offset of luminance, the minimum vatiation span of luminance, etc... More than 30 kinds of the most advanced algorithms | 
		
		
			相機 
			Camera | 
			500萬像素/高性能500萬像素/1200萬像素(可選配2000萬,2500萬像素) 
			5MP / High performance 5MP / 12MP (20 and 25MP optional) | 
		
		
			鏡頭 
			Lens | 
			高分辨率遠心工業鏡頭,20μm,15μm,12μm,10μm,8μm可選 
			High-resolution telecentric Lens, 20um, 15um, 12pm, 10μm, 8μm for option | 
		
		
			光源 
			Lamp-house | 
			環形塔狀架構,超量紅綠藍白四色LED頻閃光源 
			Ring tower structure, high intensity RGBW flash lighting | 
		
		
			| FOV | 
			48.96×40.76 mm (5MP & 20μm);36.72×30.72 mm (5MP & 15μm);50×45mm (12MP & 15μm);40×30mm (12MP & 10μm) 
			High-resolution telecentric Lens, 20μm, 15μm, 12μm, 10μm, 8μm for option | 
		
		
			0201元件 
			0201 Chips | 
			<7.6ms | 
		
		
			每畫面處理時間 
			Per-image time | 
			220~450ms | 
		
		
			錫膏印刷 
			Paste Printing Defects | 
			有無、偏斜、少錫多錫、斷路、污染 
			Missing, overflow, insufficient, pasting open, stain | 
		
		
			零件缺陷 
			Component Defects | 
			缺件、偏移、歪斜、立碑、側立、翻件、極性反、錯件、破損 
			Missing, shift, skewed, tombstone, billboard, overturned, reversed polarity, wrong, damaged | 
		
		
			焊點缺陷 
			Solder Defects | 
			錫多、錫少、連錫,銅箔汙染等(符合RoHS無鉛環保焊接檢測要求) 
			Overflow, insufficient, short solder, stain | 
		
		
			波峰焊檢測 
			Wave Soldering Inspect | 
			錫多、錫少、短路、苞焊、沙孔 
			Overflow, insufficient, short, excess solder, solder void | 
		
		
			可檢測最小元件及間距 
			Inspection Items | 
			0201&0.4mm pitch (20um);01005&0.3mm pitch (15μm) | 
		
		
			機械系統 
			Mechanism System | 
			PCB傳送系統 
			PCB Conveyor | 
			基板固定方式:bottom-up固定,自動出板和自動寬度調整系統,進板方向可一對一鍵切換,符合SMEMA標準。 
			軌道高度為900±2mm 
			Bottom to up clamping, Automatic PCB loading and unloading, automatic adjust the conveyor width, SMEMA standard communication protocol. 
			The conveyor height: 900±20mm | 
		
		
			PCB尺寸 
			PCB Size | 
			50×50mm~400×330mm | 
		
		
			PCB厚度 
			PCB Thickness | 
			0.5 ~ 5.0mm | 
		
		
			PCB翹曲度 
			PCB Warp Tolerance | 
			±2mm | 
		
		
			零件高度 
			Component Clearance | 
			TOP≤30mm, BOT≤30mm | 
		
		
			驅動設備 
			Driver | 
			交流伺服器機系統,相機在X和Y軸方向移動,(PCB固定不動有利於錫膏印刷和貼片之後的檢測) 
			AC servo system, camera moves in the directions of X/Y | 
		
		
			定位精確 
			Orientation | 
			<10μm | 
		
		
			移動速度 
			Moving Speed | 
			Standard: 500mm/s, Max: 800mm/s | 
		
		
			軟件系統 
			Soft System | 
			操作系統 
			Operation System | 
			Microsoft Windows 10 x64 | 
		
		
			操作 
			Operation | 
			圖形化程式,所見即所得,中文/英文,繁體/簡體 
			Graphic programming, language: Chinese/English | 
		
		
			編程 
			Programming | 
			支援離線編程(選配)支持AI自動畫框(選配) 
			Support offline programming (for option), Support AI automatic framing (for option) | 
		
		
			電腦主機 
			Computer | 
			工業控制主機,Intel 四核 I7 CPU,16G DDR內存,2TB硬碟 
			Industrial Computer, Intel Quad-core 17 CPU, Memory:16G, Hard disk: 2TB | 
		
		
			顯示輸出 
			Display | 
			22英吋易經寬頻顯示器 
			22-inch TFT | 
		
		
			聯網功能 
			Network | 
			聯網功能 
			Network | 
			可和NG終端聯網,在維修工作站檢查、維修PCBA錯誤 
			NG adaptable,check and correct PCBA defects at repair station | 
		
		
			MES系統對接 
			MES Supports | 
			開放標準端口 
			Standard port available | 
		
		
			其他參數 
			Others | 
			設備外型尺寸(不含信號燈) 
			Machine Dimensions(LxWxM) | 
			960x1133x1660mm | 
		
		
			重量 
			Weight | 
			~550kg | 
		
		
			額定功率 
			Power | 
			1KW | 
		
		
			電源 
			Power Supply | 
			交流220伏特±10%,頻率50/60Hz 
			AC 220V±10%, single phase 50/60Hz | 
		
		
			氣源 
			Air Supply | 
			0.5mpa, 70cm3/min | 
		
		
			使用環境 
			Working Environment | 
			溫度10-40°C,濕度30-80%RH 
			Temperature10-40"C, humidity 30-80% RH |